System integration and controls

Liquid Cooling Temperature Control System

The temperature-control system connects the external cold source, primary-side pipework, CDU and controls, secondary-side pipework and server distribution. The distributed cold-plate arrangement includes a cold source, rack-mounted CDU, primary-side pipelines, cooling medium, liquid-cooled cabinet, liquid distributor, fluid connectors, cold plates, hydraulic hose assemblies and liquid-cooled backplanes. Immersion systems add a tank or cabinet, fluid replenishment and solution recovery. Selection starts with the server heat load, required inlet-fluid conditions and permitted pressure drop.

How it works

In a cold-plate circuit, the circulating pump supplies cooled secondary fluid to the server cold plates. The coolant absorbs component heat and returns through the distribution unit and secondary pipework to the CDU plate heat exchanger. The primary circuit transfers that heat to a cooling tower, dry cooler or chiller. The air-cooling channel removes remaining server heat through IDEC, DPC, a coil air wall, a liquid-cooled door or another suitable air system. In immersion cooling, the source distinguishes single-phase and phase-change server/tank arrangements.

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Features & technical specifications10 specification tables

Product features

Temperature-control functional tests include supply-liquid temperature, differential pressure and temperature regulation.
Dual-pump switching, make-up pump start/stop and circulation-pump operation control.
Automatic fluid make-up, liquid-leakage detection and anti-condensation control.
Manual control; automatic restart after power recovery; dual-power-supply switching.
Conductivity alarm setpoint configuration.
Main-loop supply / return differential-pressure control.
Main-loop supply-liquid temperature control.
Control based on the hydraulically most unfavorable loop.

Cold source and CDU heat-exchange circuit, with cold-plate and immersion heat-removal paths.

Liquid-cooling technology routes
Heat-transfer route	Technology	Source-described equipment arrangement
Indirect	Cold-plate liquid cooling	Rack-mounted, cabinet-mounted or large CDU; air/liquid or liquid/liquid heat exchange as illustrated
Direct	Spray liquid cooling	Direct liquid-cooling route in source roadmap
Direct	Single-phase immersion liquid cooling	Immersion tank; liquid/liquid heat exchange
Direct	Phase-change immersion liquid cooling	Phase-change immersion tank; liquid/liquid heat exchange

Temperature-control product coverage
No.	Category	Source-defined equipment
1	Cold source	Abundant water: cooling tower; scarce water: evaporative dry cooler; special scenarios: chiller
2	Primary-side pipeline	Primary-side pipeline and construction
3	CDU	CDU and control system
4	Secondary-side pipeline	Secondary-side pipeline and construction
5	Distribution	Manifold
6	Immersion	Immersion tank

Server-side design information required
Design input	Source requirement
Heat load	Server power and proportion of heat removed by liquid cooling
Liquid temperature	Required inlet temperature and permitted temperature range
Wetted connections	Material requirements for inlet / outlet connections
Hydraulics	Internal server pressure drop, pressure-bearing capacity and inlet flow
External connection	Interface specification and model
Air channel	Server air inlet and outlet temperatures

Cold-plate and immersion system scope
Architecture	Source equipment scope
Cold plate	Dry / evaporative full free-cooling cold source; centralized / distributed temperature-control unit; prefabricated clean network and distribution unit; standard liquid-cooled cabinet with intelligent control
Immersion	Dry / evaporative full free-cooling cold source; centralized / distributed temperature-control unit; immersion tank / cabinet and prefabricated pipe network; fluid replenishment, solution recovery and intelligent control

Combined air and liquid heat-removal architecture
Channel	Source-described share of server heat	Cooling arrangement
Liquid	50–90%	Direct CPU liquid cooling; source describes liquid-cooled servers with built-in heat-pipe heat-exchange modules
Air	10–50%	IDEC, DPC, coil air wall, liquid-cooled door or other air-side technology; chilled-water or refrigerant-based cold source

Air-side integration options
Cold-plate combination	Air-side cold source / condition
Coil air wall	Chilled water or refrigerant-based system
IDEC	Shown as a combined architecture; source slide supplies no individual performance rating
Liquid-cooled rear door	Chilled water; high-temperature water possible if cabinet permits high-temperature inlet air
Terminator air wall	Chilled water or refrigerant-based system
All-liquid extension	Source states compressor mechanical refrigeration may be avoided; depends on permissible inlet conditions and cold source

Distributed cold-plate source performance statements
Item	Source statement (slide 1)
Single-point heat dissipation	Exceeds 700 W
Cabinet density	Can increase by 50%
PUE	<1.1
Reliability design	N+1; three-level anti-leakage design; liquid separated from electronic components
Chip temperature comparison	20–30°C below the cited air-cooling comparison; source describes longer equipment life and support for overclocking
Noise comparison	More than 30 dB reduction versus the cited air-cooled comparison
Deployment	Factory manufacturing, assembly and testing; on-site pipeline/cable connections; modular deployment

Technology overview reference statements
Item	Source reference statement (image-only slide 13)
Liquid volumetric heat capacity relative to air	1000–3500 times
Thermal conductivity relative to air	20–30 times
Precision cooling	Component-level cooling
PUE reference range	1.05–1.2
Noise reference	As low as 50 dB with no compressor and no or low-speed fans
Space reference	50–80% space savings through increased cabinet density
Technology distinction	Indirect cold-plate cooling; direct single-phase or phase-change immersion cooling

Third-party cold-plate schematic reference
Parameter	Sugon reference illustration (image-only slide 14)
Server / internal-circuit supply water	40–55°C
Server / internal-circuit return water	50–65°C
Outer-circuit supply water	35–50°C
Outer-circuit return water	45–60°C
Liquid-section PUE reference	<1.1
Air / liquid hybrid PUE reference	<1.2
Reference flow path	Cold plates → horizontal distribution manifold → vertical distribution manifold (VCDU) → CDU heat exchanger / pump → closed cooling tower (compressor-free in schematic)

Control functions and granularity
Category	Source function
Functional tests	Supply-fluid temperature, differential pressure and temperature-regulation test
Pump functions	Dual-pump changeover, make-up pump start / stop, circulation-pump operation
Fluid protection	Automatic make-up, leakage detection, anti-condensation
Operating modes	Manual operation and auto-restart after power recovery
Power	Dual-power-supply changeover
Water quality	Conductivity alarm setpoint
Loop control	Supply / return differential pressure in main loop
Temperature control	Main-loop supply-fluid temperature
Hydraulic coverage	Most unfavorable loop control

Applications

Cold-plate liquid-cooled data centers · Immersion liquid-cooled data centers · Retrofits requiring a combined air and liquid heat-removal architecture · Intelligent computing and AI clusters · Retrofitted data centers with increased capacity · Small-scale computing centers and small computer rooms · Small and micro AI training clusters · High-power-density equipment and research laboratories

Reference conditions & selection notes

Image-only slides 13 and 14 contain technical content. Slide 14 is explicitly a Sugon reference schematic; its temperatures and PUE values are not Cooltechx product ratings or promises.
The slide 1 distributed-system claims (>700 W per point, PUE <1.1, +50% cabinet density, 20–30°C chip-temperature reduction and >30 dB noise reduction) lack a defined test boundary in the source. They are reference statements requiring project confirmation; the source phrase near-zero leakage risk is a design claim rather than a quantified guarantee.
Slide 13 claims broad year-round natural cooling and cites PUE 1.05–1.2, 50 dB noise and 50–80% space savings without fluid, climate or load conditions. These are technology-overview examples, not universal outcomes.
PUE values have different source scopes: distributed cold plate <1.1 on slide 1; overview 1.05–1.2 on slide 13; Sugon liquid section <1.1 and hybrid <1.2 on slide 14; ACM system ≤1.13 on slide 25. They must not be combined into one guaranteed rating.
The liquid share of 50–90% and air share of 10–50% are architectural guidance; select the heat split from the actual server. The server inlet temperature, pressure and material requirements govern the final design.
The source uses the term heat-pipe heat-exchange modules on slide 18; it is retained as source wording and does not establish the construction of every compatible server.
The source overview names free-cooling cold sources for cold-plate and immersion systems. Annual availability and compressor-free operation require assessment of weather, water resources, server temperature limits and the remaining air-side cooling load.

Liquid Cooling Manual, pp. 1 and 12–20, 24, 28 and 33; pp. 13–14 include reference illustrations